Specifications For Mediatek Helio A22 Chipset Disclosed
Xiaomi previously this week declared its newest budget handset in the shape of Redmi 6A handset. The handset is fueled by Helio A22 SoC by MediaTek (the Taiwanese semiconductor-manufacturer) and lately MediaTek has offered the details of its chipset.
The MediaTek Helio SoC is a quad-core chip that comes equipped with 4 ARM Cortex-A53 chips (utmost 2.0GHz frequency) in addition to an IMG PowerVR GE-class GPU. It is well-matched with both LPDDR3 and LPDDR4X RAM and has support for eMMC 5.1 memory type. The firm has stated that the CPU of Helio A22 is 30% quicker and the GPU is 72% enhanced than its “direct option.”
With an HD+ 1600 x 720 pixel resolution and up to 20:9 aspect ratio, the Mediatek Helio SoC can house the almost notch-less or notched screens. This indicates that we can hope to witness all-screen and notch-less screens in the coming period, possibly sooner than we expect.
The connectivity options for Helio A22 are Beidou, GPS, GLONASS, Galileo, Wi-Fi 802.11ac, GPS, FM radio, Bluetooth v5.0, and Cat-4 LTE. It is also equipped with the latest 4G LTE WorldMode modem. This means support for dual 4G SIM with ViLTE/VoLTE to well-matched Android.
The SoC has also been integrated with AI abilities granted by the Light Edge AI engine. They comprise software-supported Face Unlock (Face ID), enhanced dual or single-camera Bokeh effects, and Smart Photo Album.
The SoC is well-matched with almost 13 MP + 8 MP in a setup for dual camera and almost 21 MP in the solo-camera mode. It makes employment of twin ISP (image signal processors) to snap pics with Bokeh effect in a setup for dual camera, and employs “clever AI capability” in solo camera setups.
On a related note, MediaTek earlier launched its Helio P22 chipset, specially developed for mid-section handsets. The firm states that it is the first chip to convey the 12nm manufacturing procedure to the mid-range mobile section.