Xiaomi previously this week declared its newest budget handset in the shape of Redmi 6A handset. The handset is fueled by Helio A22 SoC by MediaTek (the Taiwanese semiconductor-manufacturer) and lately MediaTek has offered the details of its chipset.
The MediaTek Helio SoC is a quad-core chip that comes equipped with 4 ARM Cortex-A53 chips (utmost 2.0GHz frequency) in addition to an IMG PowerVR GE-class GPU. It is well-matched with both LPDDR3 and LPDDR4X RAM and has support for eMMC 5.1 memory type. The firm has stated that the CPU of Helio A22 is 30% quicker and the GPU is 72% enhanced than its “direct option.”
With an HD+ 1600 x 720 pixel resolution and up to 20:9 aspect ratio, the Mediatek Helio SoC can house the almost notch-less or notched screens. This indicates that we can hope to witness all-screen and notch-less screens in the coming period, possibly sooner than we expect.
The connectivity options for Helio A22 are Beidou, GPS, GLONASS, Galileo, Wi-Fi 802.11ac, GPS, FM radio, Bluetooth v5.0, and Cat-4 LTE. It is also equipped with the latest 4G LTE WorldMode modem. This means support for dual 4G SIM with ViLTE/VoLTE to well-matched Android.
The SoC has also been integrated with AI abilities granted by the Light Edge AI engine. They comprise software-supported Face Unlock (Face ID), enhanced dual or single-camera Bokeh effects, and Smart Photo Album.
The SoC is well-matched with almost 13 MP + 8 MP in a setup for dual camera and almost 21 MP in the solo-camera mode. It makes employment of twin ISP (image signal processors) to snap pics with Bokeh effect in a setup for dual camera, and employs “clever AI capability” in solo camera setups.
On a related note, MediaTek earlier launched its Helio P22 chipset, specially developed for mid-section handsets. The firm states that it is the first chip to convey the 12nm manufacturing procedure to the mid-range mobile section.